FSA644UCX

Manufacturer	FAIRCHILD SEMICONDUCTOR CORP
Part Package Code	CSP
Pin Count	36
Manufacturer Package Code	36 BALL WLCSP, 6X6 ARRAY, 0.4MM PITCH, 250UM BALL, 539UM MAX THICKNESS
Reach Compliance Code	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01
Analog IC – Other Type	SPDT
JESD-30 Code	S-PBGA-B36
JESD-609 Code	e1
Moisture Sensitivity Level	1
Number of Functions	10
Number of Terminals	36
On-state Resistance-Max (Ron)	12 Ω
Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C
Output	SEPARATE OUTPUT
Package Body Material	PLASTIC/EPOXY
Package Code	FBGA
Package Equivalence Code	BGA36,6X6,16
Package Shape	SQUARE
Package Style	GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel)	260
Qualification Status	Not Qualified
Surface Mount	YES
Switching	BREAK-BEFORE-MAKE
Temperature Grade	INDUSTRIAL
Terminal Finish	TIN SILVER COPPER
Terminal Form	BALL
Terminal Pitch	0.4 mm
Terminal Position	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30

Product Detail

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