PCA9555PW

Manufacturer	NXP SEMICONDUCTORS
Part Package Code	TSSOP
Package Description	TSSOP-24
Pin Count	24
Reach Compliance Code	compliant
ECCN Code	EAR99
HTS Code	8542.39.00.01
Samacsys Manufacturer	NXP
JESD-30 Code	R-PDSO-G24
JESD-609 Code	e4
Length	7.8 mm
Moisture Sensitivity Level	1
Number of Bits	16
Number of I/O Lines	16
Number of Ports	2
Number of Terminals	24
Operating Temperature-Max	85 °C
Operating Temperature-Min	-40 °C
Package Body Material	PLASTIC/EPOXY
Package Code	TSSOP
Package Equivalence Code	TSSOP24,.25
Package Shape	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260
Qualification Status	Not Qualified
Seated Height-Max	1.1 mm
Supply Voltage-Max	5.5 V
Supply Voltage-Min	2.3 V
Supply Voltage-Nom	3 V
Surface Mount	YES
Technology	CMOS
Temperature Grade	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING
Terminal Pitch	0.65 mm
Terminal Position	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	4.4 mm
uPs/uCs/Peripheral ICs Type	PARALLEL IO PORT, GENERAL PURPOSE

Product Detail

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